Immersion Silver

Surface Finishing

Information

Application：

Immersion silver, as a lead-free PCB finished surface treatment process, serves for depositing a layer of silver with thickness of 6~16μ inch on copper surface through replacement reaction to ensure flat surface; it has good conductivity and solderability.

Advantage introduction：

Smooth surface, suitable for package of SMD and BGA;

Standard surface for Au-wire & Al-wire bond, can replace electroplating nickel/gold or ENIG;

Can replace electroplating nickel or silver for bonding, good reflexes as surface;

Good electroconductivity for contact conduction application;

Low risk of electromigration and low galvanic effect.

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